Parameter | Glass Wafer Standard Specification |
Material | Glass, Fused Silica etc. |
Diameter | 4”, 6”, 8”, 12” etc. |
Diameter Tolerance | +/-0.01mm |
Mini. THK. | 0.2mm(< 6”), 0.3mm(8”), 0.35mm(12”) |
TTV | <1μm |
BOW | <20μm |
WARP | <30μm |
Surface Quality | 20-10 |
Roughness | Ra<0.2nm |
Chamfer | 45°, C0.2+/-0.1mm |
Coating | AR film, Reflection film, Splitter film etc. |
* Remark:Customized is available |